Real Time Virtual Prototypes
What is RTVP?
A new model exchange format that can capture geometry-based behaviour, in addition to circuit behaviour. The concept extends an existing model exchange standard, the Functional Mock-up Interface (FMI) to incorporate SPICE-like circuit models and geometrical models. Specifically designed with Power Electronics in mind, RTVP models allow complex models to be imported into commercial simulation tools such as Simulink.
Pre-release Examples
Download some precompiled RTVP FMUs from DemoModels/FMU and Simulink simulation models from DemoModels/Simulink.
Also download the RTVP co-simulation tool installer to run alongside the Simulink simulation visualise the RTVP-FMU models.
Further documentation is available to view here.
How does it work?
We use our own in-house virtual prototyping software to design the model geometry. The mesh is generated for use in the simulation. After this, an FMU export option saves a number of files ready to be used in the creation of the 3D-RTVP FMU model. Internally, Reduced-Order Modelling methods are used to maintain simulation efficiency.
A co-simulation tool is proposed that allows the models to stream 3D visualisations of their internal state, in real-time, as the simulation progresses.
This work was presented in Grenoble, France at the 2024 IEEE Design Methodologies Conference. Refer to this publication for further details, Real Time Virtual Prototypes for Power Electronics.
Demonstration Videos
Related Publications
- Real Time Virtual Prototypes for Power Electronics, 2024 IEEE Design Methodologies Conference (DMC)
- A Fast and Accurate GaN Power Transistor Model and Its Application for Electric Vehicle, IEEE Transactions on Vehicular Technology
- Datasheet Based SiC MOSFET Models for Accurate Switching Waveform Prediction in Virtual Prototyping Applications, 2023 IEEE Design Methodologies Conference (DMC)
- Behavioural SiC IGBT Modelling Using Non-Linear Voltage and Current Dependent Capacitances, 2023 IEEE Design Methodologies Conference (DMC)
- Magnetic material modelling using the PEEC method and linear basis functions, 2022 IEEE Design Methodologies Conference (DMC)
- Implementation of Multi-Expansion Point Model Order Reduction for Coupled PEEC-Semiconductor Simulations, 2022 IEEE Design Methodologies Conference (DMC)
- Real-Time Electromagnetic Visualisation for Large 3D Accelerated Models”, 2022 IEEE 23rd Workshop on Control and Modeling for Power Electronics (COMPEL)
- Multi Expansion Point Reduced Order Modelling for Electromagnetic Design of Power Electronics, 2021 IEEE Design Methodologies Conference (DMC)
- Real-Time Electromagnetic Visualisation using Augmented Reality and Accelerated 3D Models”, 2021 IEEE 22nd Workshop on Control and Modelling of Power Electronics (COMPEL)
- Modelling GaN-HEMT Dynamic ON-state Resistance in High Frequency Power Converter, 2020 IEEE Applied Power Electronics Conference and Exposition (APEC)
- Real-Time Thermal Imaging Using Augmented Reality and Accelerated 3D Models,” 2020 IEEE 21st Workshop on Control and Modeling for Power Electronics (COMPEL)
- Characterisation and Modeling of Gallium Nitride Power Semiconductor Devices Dynamic On-State Resistance, IEEE Transactions on Power Electronics
- Developing Power Semiconductor Device Model for Virtual Prototyping of Power Electronics Systems, 2016 IEEE Vehicle Power and Propulsion Conference (VPPC)
- Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems, IEEE Transactions on Power Electronics
- Automated Fast Extraction of Compact Thermal Models for Power Electronic Modules, IEEE Transactions on Power Electronics
Contact Us
For any queries, please contact Dr Paul Evans.